Multi-chip interconnects is a research area focused on the methods, technologies, and design principles for establishing electrical, optical, or other forms of communication links between two or more discrete semiconductor chips integrated within a single package or module. This field investigates the challenges and solutions related to achieving high bandwidth, low latency, power efficiency, signal integrity, and physical density in these inter-chip connections, which are critical for enabling advanced heterogeneous integration and performance scaling in modern electronic systems by overcoming limitations of monolithic chip design.